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Availability:
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free for staff and students of Hamburg University of Applied Sciences
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Licensed Period:
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IEEE Electronic Library (IEL) Fachhochschulkonsortium:
Vol. 17 (1994) - Vol. 21 (1998)
ReadMe
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Fulltext:
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https://ieeexplore.ieee.org/servlet/opac?punumber=95
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Homepage(s):
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Fulltext available since:
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Volume 17
(1994)
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Fulltext available until:
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Volume 21
(1998)
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Publisher:
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Institute of Electrical and Electronics Engineers (IEEE) ; IEEE Components, Packaging and Manufacturing Technology Society
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ZDB-ID:
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2027510-9
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Subject(s):
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Electrical Engineering, Electronics and Communications Engineering, Mechanical Engineering
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Tag(s):
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Elektronik, Fertigungstechnik
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E-ISSN(s):
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1558-3678
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P-ISSN(s):
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1070-9886
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Appearance:
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Fulltext, online and print
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Costs:
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subject to fee
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Comment:
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Erscheinungsverlauf: 1.1965 - 7,1971,1 u.d.T.: IEEE Transactions on Parts, Materials and Packaging (0018-9502); 7.1971,2 - 13.1977 u.d.T.: IEEE Transactions on Parts, Hybrids, and Packaging (0361-1000); 1.1978 - 16.1993 u.d.T.: IEEE Transactions on Components, Hybrids, and Manufacturing Technology (0148-6411); 17.1994 - 21.1998 u.d.T.: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A (1070-9886); Ab 22.1999 u.d.T.: IEEE Transactions on Components and Packaging Technologies (1521-3331).
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List of participate institutions which offer full access.
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