|
Availability:
|
free for staff and students of Hamburg University of Applied Sciences
|
|
Licensed Period:
|
IEEE Electronic Library (IEL) Fachhochschulkonsortium:
Vol. 19 (1996) - Vol. 21 (1998)
ReadMe
|
|
Fulltext:
|
https://ieeexplore.ieee.org/servlet/opac?punumber=3476
|
|
Homepage(s):
|
|
|
Fulltext available since:
|
Volume 19
(1996)
|
|
Fulltext available until:
|
Volume 21
(1998)
|
|
Publisher:
|
Institute of Electrical and Electronics Engineers (IEEE) ; IEEE Components, Packaging and Manufacturing Technology Society
|
|
ZDB-ID:
|
3135007-0
|
|
Subject(s):
|
Electrical Engineering, Electronics and Communications Engineering, Mechanical Engineering
|
|
Tag(s):
|
Elektronik, Fertigungstechnik
|
|
E-ISSN(s):
|
1558-1241
|
|
P-ISSN(s):
|
1083-4400
|
|
Appearance:
|
Fulltext, online and print
|
|
Costs:
|
subject to fee
|
|
Comment:
|
Volltextzugang via IEEE/IEE Electronic Library (IEL); Ab 1999 u.d.T.: IEEE Transactions on Electronics Packaging Manufacturing (1521-334X); Auch die Jg. 19.1996 - 21.1998 u.d.T.: IEEE Transactions on Electronics Packaging Manufacturing: Link: Title History
|
|
|
List of participate institutions which offer full access.
|
