In order to develop the USA as a strategic region, HAW Hamburg is a member of the German UAS7 consortium as well as the international Global E3 Network.
UAS7 - Consortium of 7 German universities of applied sciences
HAW Hamburg has been a member of UAS7 since 2005. The consortium of seven German universities of applied sciences (HWR Berlin, Hochschule Bremen, HAW Hamburg, TH Köln, FH München, FH Münster, FH Osnabrück) opened an office in New York in 2006 in order to increase awareness for universities of applied sciences in the US and to develop collaboration in teaching and research.
UAS7 also started the SIP+ scholarship programme for US students, who want to complete a study and/or internship semester in Germany. As part of this programme the UAS7 universities offer classes in English as well as research projects in universities labs.
Through UAS7 HAW Hamburg has three partner universities in addition to the ten bilateral exchange agreements in the US: University of Pittsburgh, State University of New York (SUNY) at Albany as well as Drexel University. With these universities as well as with the German Academic Exchange Service (DAAD) and the German House in New York UAS7 offers panels and workshops on topics such as academic knowledge transfer, teaching and applied research at German universities of applied sciences. UAS7 website
Global E3 Network - Engineering Exchange
HAW Hamburg became a member of the Global E3 network in 2014, whose goal is to increase mobility of engineering students and prepare them for the global workplace. The network has over 80 members all over the world, 37 of whom are US universities. HAW Hamburg regularly exchanges students as part of this network. The yearly conference is also an important platform for faculty and academic staff exchange. Global E3 Website
With Global E3 US students can go abroad and get a German engineering experience: Anthony DiNardi, mechanical engineering student from Clemson University, studied in Hamburg to get an insight into aeronautical engineering. Read more.